6 DECEMBER 2022Chip-making requires sophisticated, expensive, and highly polluting processes. It needs critical changes from its design to materials selection to address the growing demand for semiconductors. Advanced packaging in the semiconductor industry is witnessing a continuous transformation in this regard. Electronic packaging technologies are significantly affecting chip power, performance, and cost, allowing manufacturers to merge multiple components into a single electronic device with better signal connections. The micro-system packaging and multi-flip chip technology protect silicon chips from mechanical vibrations and thermal stress. The advanced materials in packaging also bring high voltage resistance, higher operating temperatures, faster switching, and a smaller form factor, delivering cost-effective and robust solutions within the chip size. Driven by these technological trends, the industry is expected to reach $87.4 billion by 2030 at a CAGR of 4.6 percent.To put the spotlight on such key developments in the industry, Semiconductor Review illustrates how the semiconductor packaging space is leveraging the breakthroughs made in the semiconductor market. This edition also features thought leadership articles from subject matter experts. Some of the exclusive insights are authored by Dhaval Dhayatkar, Senior Director, Plasma Power Products at Advanced Energy; Kevin Kettler, Corporate Vice President at Boyd; Scott D'Cruze, Global Supplier Account Manager at Newark; and Kevin Anderson, Director Integration Technology Research at Qorvo. They shed light on advanced power technologies for single and dual magnetron sputtering, new-wave semiconductors with sustainability initiatives, and product offerings with ever-increasing functionality and bandwidth, all with a premium on size, power consumption, and cost. In this edition of Semiconductor Review, we also bring to you the story of the top semiconductor packaging solution providers. In the list, ASM stands out for its comprehensive range of solutions linking the entire semiconductor packaging and assembly value chain. They help customers achieve higher productivity, reliability, and quality for decades.Through the following pages, we aim to shine a light on the innovative trends and latest developments in the semiconductor packaging industry. We would like to know your thoughts.Advanced Packaging Solutions with Advanced MaterialsJames PhillipsCopyright © 2022 ValleyMedia Inc. All rights reserved. Reproduction in whole or part of any text, photography or illustrations without written permission from the publisher is prohibited. The publisher assumes no responsibility for unsolicited manuscripts, photographs or illustrations. Views and opinions expressed in this publication are not necessarily those of the magazine and accordingly, no liability is assumed by the publisher thereof.Editorial StaffAlex D'souzaRussell ThomasCatalina JosephManaging EditorRichmond Smith*Some of the Insights are based on our interviews with CIOs and CXOsVisualizerChris LynnContact Us:Email:sales@semiconductorreview.comeditor@semiconductorreview.commarketing@semiconductorreview.com December - 20 - 2022, Vol 03 Issue 22Published by ValleyMedia Inc.To subscribe to Semiconductor ReviewVisit www.semiconductorreview.com Richmond smithManaging Editoreditor@semiconductorreview.comYenny TurnerTiffany HayworthAbner LawrenceGina Clumsky
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