9JUNE 2025APACAPACTRENDS TO WATCH IN THE 3D ERAWe are collecting richer data from our equipment and using more advanced data science techniques to convert that into repeatable processing of millions of wafersor etch techniques to handle the demands of 3D structures, or even the integration of both deposition and etch capabilities, with an eye toward better coverage of 3D topography and in-situ repair processes. This approach may accelerate reliable film creation in the most challenging high-volume situations.More Advanced Logic Chips Will Need More Advanced Interconnect MetalsTungsten and tungsten oxides have already begun to replace damascene copper in some logic interconnects. As scaling in the 3D era continues, wafer fabrication technologies are pushing the boundaries of traditionally used metals to achieve less resistance and minimize power consumption and signal loss. Alternative metals such as Molybdenum are also being explored, particularly for backend applications.The Integration of Chiplets Will Enable Greater Scaling to Extend Moore's LawAs silicon scaling becomes more expensive, it also becomes more challenging to hold to the traditional development time between technology nodes. Chipmakers are adopting chiplet-based solutions to enable scaling beyond silicon. Packaging plays a significant role in driving greater system-in-package integration and extending Moore's Law. TSV etch and plating solutions will be critical in high-aspect ratio integration schemes for advanced packaging solutions. New substrate-based approaches are also necessary to meet the requirements for next-level interconnect. Lam's recent acquisition of SEMSYSCO broadens its packaging offerings to bring innovative cleaning and plating capabilities for chiplet-to-chiplet or chiplet-to-substrate heterogeneous integration.Data Insights Will Drive Greater Operational EfficiencyAI-based predictive modeling techniques are accelerating R&D and enabling chipmakers to get to the manufacturing step faster, while giving tool and process developers new insights and greater efficiency. Increasingly, data has also become a critical asset during the manufacturing process. In-chamber sensors can monitor tool consistency and help quickly detect issues. A great example is Lam's groundbreaking, self-aware Sense.i® platform, which brings together data intelligence with advanced plasma etch capabilities in a compact, high-density architecture to deliver high-productivity process performance. Powered by Lam's Equipment Intelligence® technology, the Sense.i platform delivers the critical etch capabilities required to continue advancing uniformity and etch profile control for maximizing yield and lowering wafer costs. Sense.i enables semiconductor manufacturers to capture and analyze data, including pattern recognition, and specify actions for improvement. Sense.i also features autonomous calibration and maintenance capabilities that reduce downtime and labor costs and deliver machine learning algorithms that allow the tool to self-adapt to minimize process variations and maximize wafer output.Sustainable Innovation Will Deliver Performant Chips That Use Fewer MaterialsAs demonstrated by Lam's 2021 goal of 100 percent renewable energy by 2030 and to achieve net zero by 2050 and the formation of SEMI's Semiconductor Climate Consortium in 2022, there is increasing focus on advancing sustainability. Many chipmakers are looking for manufacturing equipment and technologies to not only deliver the right performance and cost structure, but also support their long-term goals to reduce power consumption and use fewer materials.The growth of sophisticated electronic devices that demand increasingly advanced semiconductor technology is challenging WFE providers and chipmakers to think beyond current methods and materials in the 3D era. Continued collaboration, innovation and new breakthroughs that take fresh approaches and leverage abundant data may hold the keys to powering progress and more sustainable manufacturing to deliver leading-edge technology.
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