2 JUNE 2024ONTOS CLEANATMOSPHERIC PLASMA SURFACE TREATMENT· Photonics· Semiconductor· Automotive· Aerospace· MedicalINDUSTRIES:Improve Bonding with Atmospheric Plasma Surface cleaning and activationFeatures:Chamber-free plasma operates at ambient pressureSafe for sensitive CMOS devicesNo ion bombardment, ESD safe, particle freeRadical gas chemistry from Hydrogen, Oxygen, or NitrogenUtilizes Argon or Helium carrier gasLarge work area accommodates wide range of substrate sizes from 1mm chips to 300mm wafers and dicing film framesIn-situ metrology and custom designs availableSales Contact+1 603.548.7870mphillips@OntosPlasma.comwww.OntosPlasma.comApplications:Cleans metal oxides from bonding surfacesRemoves residual organic contamination filmsIdeal surface preparation for:· Hybrid and Direct bonding· Thermocompression and Eutectic bonding· Direct Bandgap InP, GaAs, GaN, other III-V materials· Gold, Indium, Tin, Silver, Nickel, Copper, and more· Dielectric SiO2, SiCN, Polyimide, BCB· Quantum Computing Interconnects and OpticsSurface activation and enhanced wetting· Preparation for thin-film deposition· Capillary underfill· Photoresist adhesion · Electroplating wettingRemoving thin films of Amorphous Carbon
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