Jet Process
Catalyzing Progression in Photonics

Photonics innovation holds world-changing potential, but the journey from the laboratory to real-world applications is fraught with complexities. Companies seeking to harness the power of photonics require tailored solutions that bridge the gaps between conception to manufacturing.

Enter Jet Process, a company that is meeting the rising demand for custom coating and fabrication options. It is addressing the increasing complexity of photonic devices and the growing need for seamless integration with external fiber channels. Its focus is on optimizing the interface between optics and electronics.

Whether it is bonding photonic chips to silicon packages or designing intricate metallization and packaging schemes, Jet Process helps customers resolve difficult challenges. Its versatile process readily adapts to a diverse array of wafer device substrates based on client specifications. Customers can opt to fabricate silicon circuits separately or pursue integrated photonics with silicon on a single chip—either way, Jet Process tailors customized solutions to meet their needs.

“Our mission at Jet Process is to ensure our clients have a trustworthy partner that will provide both the technical sophistication and the responsive collaboration needed to successfully deliver their photonic designs from concept to reality,” says Takashi Tamagawa, managing engineer, Jet Process.

Managing the intersection between photonic devices and other components is crucial. Integration of external fiber channels and interconnects with photonic elements is a significant effort, emphasizing a smooth optics-electronics interface.

While Jet Process may not delve into design details, it is pivotal in enabling a seamless integration process.

On the electronics side, whether discrete silicon circuits or integrated photonics on a single chip, Jet Process provides vital direction for complex metallization and packaging configurations. Its packaging versatility facilitates customizable integration for photonic devices, using materials like gold-tin alloys for bonding chips and components.

Jet Process extends its proficiency beyond materials by offering advanced metallization capabilities. The process allows low-temperature metal patterning through resist masking or mechanical shadow masks. This selective mastery matches diverse customer needs, producing intricate metal shapes, films, and layers for sturdy bonding.

The bonding ingenuity begins with understanding each customer’s specific device requirements, encompassing alloy types, dimensions, and pad geometries. Jet Process leverages past experiences and collaborates with clients to navigate development obstacles, ensuring innovations safely transition from lab demos to durable commercial products.

Jet Process has demonstrated its adaptability by tackling novel challenges, such as bonding compound semiconductor laser devices onto silicon chips. With mastery of low temperature gold-tin metallization, it has the ability to adjust the gold-to-tin ratio to achieve the bonding properties needed for the individual customer’s unique challenges.

Through years of guiding photonic innovations, Jet Process has cultivated versatile fabrication expertise and a robust knowledge base, positioning it to recommend proven, tailored packaging schemes. Metal trace patterning expands their interconnect offerings beyond solder mastery, adapting processes from extensive exposure with industry pioneers.

While cautiously scaling emerging capabilities, Jet Process extends gold alloy offerings to meet customer demand. In this accelerating field, it stands ready to make the improbable possible, delivering flexible solutions to turn ideas into issue-free manufactured products.