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May 2023

Semiconductor Manufacturing

Contents
April-12 2023

Photonics Europe

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February-March 2023

System-on-Chip SoC APAC

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III-December-2022-January 2023

Assembly and Testing Services

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December-02 2022

FPGA APAC

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November-04 2022

Photonics APAC

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October-12 2022

Optoelectronics APAC

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September-05 2022

Semiconductor Testing APAC

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Magazine Archive

Semiconductor Tech APAC Special- December-05, 2022

Contents

Nextin, Inc.: The Bridge to Effective Defect Detection

December-05

View Digital Version

8

Agile Development of AI Defect Detection Using CNN

Marco Chan, VP of Technology, Wise Ally International Holdings Limited
16

M&As in the Semiconductor Industry are Here to Stay

David Stein, Vice President, Global Supplier Management, Digi-Key Electronics
18

New Platform for Multimodal Spectroscopic Characterization of Semiconductors

Francis C. Ndi, Product Line Manager, HORIBA
21

Forging the Pathway to New- Wave Semiconductors

Kevin Kettler, Corporate Vice President, Boyd
22

RF Power Sensing for Productivity and Calibration

Adam Fleder, Senior Director of Product Management, Advanced Energy
28

Unlocking the True Value of Data – Lessons from the Journey

Adarsha Marpalli, Global Head, Data Governance and Insights, Nexperia
30

Digital Transformation Doesn’t Happen Without Change and Diversity

Franco Chiam, Vice President, IDC Asia/Pacific

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NEXTIN, Inc.: The Bridge to Effective Defect Detection

Chris Park, CEO

NEXTIN, Inc.: The Bridge to Effective Defect Detection